Hong Kong Announces Tender for 5-Year RMB Government Bonds

The Hong Kong Monetary Authority (HKMA), representing the Hong Kong Special Administrative Region Government, has announced a tender for 5-year RMB Institutional Government Bonds. Scheduled for May 13, 2025, the tender will see RMB1.5 billion worth of bonds offered, maturing on May 15, 2030, with an interest rate of 1.97% per annum, according to the Hong Kong Monetary Authority.

Details of the Bond Tender

The tender will be open exclusively to Primary Dealers under the Infrastructure Bond Programme. Interested parties can apply through any Primary Dealer listed on the Hong Kong Government Bonds website. Each tender must be for RMB50,000 or integral multiples thereof. The results of the tender will be announced on the HKMA’s website, Bloomberg, and Refinitiv by 3:00 pm on the tender day.

Bond Characteristics

The bonds, identified by issue number 05GB3005001 and stock code 85023 (HKGB1.97 3005-R), will carry interest payments twice a year on May 15 and November 15. The bond issuance will support infrastructure projects in line with the Infrastructure Bond Framework, highlighting the government’s commitment to sustainable development.

Market Implications

The issuance of these bonds is part of Hong Kong’s broader strategy to bolster its financial infrastructure and investment in public projects. The bonds are set to commence trading on the Hong Kong Stock Exchange on May 16, 2025. This move is anticipated to attract significant attention from institutional investors looking for stable returns amidst global economic uncertainties.

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